PCB Blog - Share blogs related to PCB fabrication

Configuration:​ 8-Layer Rigid-Flex Construction
Base Material:​ FR4 and Polyimide (PI) Combination
Stack-up:​ 4-Layer FR4 Rigid Sections + 4-Layer Flex Circuit
Finished Thickness:​ 0.2mm (Flex Region) + 0.8mm (Rigid Region)
Copper Weight:​ 1 oz (Approx. 35µm)
Solder Mask:​ Green or White
Surface Finish:​ Immersion Gold (ENIG)
Minimum Trace/Spacing:​ 5/5 mil (Inner/Outer Layers)
Minimum Drill Size:​ 0.2mm (Mechanical Holes)
Application:​ Primary Use in Equipment Switching PCBs (e.g., network switches, routers)

Material Composition:​ FR4 + PI
Layer Build-up:​ FR4 4L + FLEX 2L
Finished Thickness:​ 0.15mm + 0.55mm
Copper Thickness (per layer):​ 1/1/1/1/1/1 OZ
Solder Mask Color:​ Green / White
Surface Finish:​ Immersion Gold (ENIG)
Minimum Trace/Space:​ 4mil/4mil
Application:​ Module Integration

Model Identifier:​ Automotive PCB (HDI R-FPCB)
Base Material Composition:​ FR-4 (Rigid Section) + Polyimide (Flexible Section)
Layer Construction:​ 1+2+1 (1 Rigid Layer + 2 Flex Layers + 1 Rigid Layer)
Solder Mask Color:​ Green / White
Overall Finished Thickness:​ 1.2 mm
Copper Foil Thickness:​ 0.035 mm (1 oz/ft²)
Final Surface Finish:​ Electroless Nickel Immersion Gold (ENIG), 2µ" (Micron Inches) Gold Thickness
Minimum Feature Size:​ 0.1 mm line width / 0.1 mm spacing
Primary Application:​ Prototype development for automotive electronics utilizing rigid-flex PCB technology.

Product Category:​ Rigid-Flex PCB (R-FPCB)
Construction Material:​ FR-4 (Rigid) & Polyimide (Flexible)
Layer Stack-up:​ 2-Layer Rigid / 2-Layer Flexible / 2-Layer Rigid
Solder Mask / Silkscreen:​ Green / White
Finished Board Thickness:​ 1.0mm (Rigid Core) + 0.15mm (Flexible PI)
Copper Weight (Thickness):​ 1 oz (0.035mm)
Surface Finish:​ Immersion Gold (ENIG)
Minimum Trace/Space:​ 0.1mm / 0.1mm
Target Application:​ Digital Product Rigid-Flex PCB Prototype Development

Model:​ Smart Health Assistant Rigid-Flex PCB (FPCB)
Construction Material:​ FR-4 and Polyimide (PI) composite
Layer Count:​ 6-Layer stack-up
Solder Mask Color:​ Green / White
Rigid Board Thickness:​ 0.8 mm
Flexible Circuit Thickness:​ 0.2 mm
Copper Weight/Thickness:​ 0.025 mm
Surface Finish:​ Immersion Gold (ENIG)
Minimum Trace Width / Spacing:​ 0.1 mm
Application:​ Smart Health Assistant Rigid-Flex PCB (FPCB)

Product Designation:​ Blue Solder Mask Rigid-Flex PCB (R-FPCB)
Base Material:​ FR-4 / Polyimide (PI) Combination
Layer Count:​ 4-Layer Construction
Solder Mask / Silkscreen Color:​ Blue / White
Finished Board Thickness:​ 0.6 mm
Copper Foil Thickness:​ 0.025 mm (1 oz equivalent)
Surface Finish:​ Immersion Tin (ISn) Treatment
Minimum Trace Width / Spacing:​ 0.1 mm / 0.1 mm
Primary Application:​ Communication and Digital Electronic Systems utilizing Rigid-Flex PCB (R-FPCB) technology.

Product Type:​ 6-Layer Panel Button Rigid-Flex PCB (R-FPCB)
Base Material Composition:​ FR-4 and Polyimide (PI)
Layer Build-Up Configuration:​ 4-layer FR-4 rigid substrate coupled with a 2-layer Polyimide flexible circuit.
Physical & Electrical Properties Overall Finished Thickness:​ 0.15 mm
Copper Weight (Finished):​ 1 oz/ft²
Minimum Trace Width / Spacing:​ 6 mil / 6 mil
Minimum Drilled Hole Diameter (Mechanical):​ 0.2 mm
Finishes & Appearance Surface Finish (Plating):​ Immersion Gold (ENIG)
Solder Mask Color Options:​ Green or White
Primary Target Application Intended Use:​ Printed circuit boards for mechanical equipment, where a combination of structural rigidity and dynamic flexing is required.